There are several components which influence the image quality. - X-Ray tube with energy and dose settings (kV and mA) - Diaphragm to reduce scatter radiation by masking the object only - Pre-Filter to avoid overexposure and filter low energy quants - Contrast from the object - Visibility of the Image Quality Indicator - Position of the object in the beam (magnification) and - hopefully - no movements during exposure - Pre-Filter in front of the detector - Detector (DDA, Film, Image Intensifier [Radioscopy], or CR) - Software for detector calibration - Software for image enhancement - Quality of display unit and Experience of the inspector viewing the monitor - or quality of the software evaluating the image including a 3D CT imaging software
The variances in the mainly three component groups are
The system with the highest detail visibility for large parts is slow and expensive ...
Compared to amorphous silicon detectors, CMOS detectors have lower dynamic range and lower noise, does this mean it is more suitable for DR of composites and does it have the potential to detect delamination in composites?
Due to the lower noise CMOS detectors could have a higher dynamic range - please look into in the CMOS thread. For thin layers of composites CMOS detectors could be an advantage as there lower energies are used. But I think it is hard to see delaminations - to see theses you would need to angle of penetration which allows to see the gap. With a standard 2D inspection with orthogonal penetration you have nearly no material differences and therefore no signal difference.